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SPIE Photomask Technology Conference
September 13 - 16, 2010
Monterey Marriott
Monterey, California, USA
GSA Expo&Conference;
September 16, 2010
Santa Clara, California, USA
2010 Directions in Engine-Efficiency and Emissions Research (DEER) Conference
September 27 - 30, 2010
Detroit, Michigan
International Test Conference 2010
October 31-November 5, 2010
Austin, Texas, USA
1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits (3D-Test)
in conjunction with ITC / Test Week 2010
November 4-5, 2010
Convention Center - Austin, Texas, USA
Customers rank Advantest a 10 BEST company
for 22 consecutive years
Committed to the cutting-edge research and development, Advantest employees publish papers on the latest hot issues in testing in the world's premier conferences and journals. These papers present state-of-the-art methodologies and solutions for SoC, embedded memories, high-speed analog/mixed-signal circuits, tester architecture and test development. The concepts described in these papers solve the burning problems and are beneficial to the whole semiconductor industry.
  
In-House Manufacturing Remains a Core Competency at Advantest
  
Demand Spikes for Multi-Site Testing
  
Breaking the Barriers to RF Multi-DUT Tests
  
E-Beam Technology Breaks Through Complex Design Cycles
  
Advantest Boosts Tested Multichip Packages per Hour
  
Navigating the Outsourcing Options
  
Reducing EVM Test Time And Identifying Failure Mechanisms
  
MIMO challenges existing ATE
  
Ultrawideband SoCs pose new challenges to manufacturers
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