The M4741A accomplishes solid contact for testing narrow pitch/miniature advanced functionality devices, such as those used in mobile equipment, enabling improved yields and lower cost of test.

Device positioning using vision alignment
Advanced device packaging is trending towards miniaturization and narrowing ball/lead pitch, resulting in higher rates of mis-contact between the device and the contactor when mechanical alignment is employed. These higher numbers of mis-contacts adversely affect the yield. The M4741A, however, employs vision alignment to more accurately position the devices and contactors. Therefore, it achieves solid contact with devices that both are very small and are characterized by narrow pitch.

Dramatically reducing the cost of testing and time to market new devices
Vision alignment has greatly increased the ability for sharing device change kits among families of devices. In particular, area-array devices, typified by CSP, can be handled, under certain conditions, by the same change kit. Eliminating the need for a separate change kit for each new product, the M4741A lowers the product deployment costs, reduces development time and time to market, and also mitigates the production floor kit management.

Providing a rich menu of options 
The M4741A is rich in options to promote improved productivity and flexibility. For example, the layout unit adapts to a given socket’s particular layout, optimized according to test conditions. Other available options include measures to prevent static electricity from damaging devices, as well as high accuracy temperature testing. The M4741A can also be equipped for mechanical alignment with x8 parallelism. 

Key Specifications