Flash memory with built-in self-test (BIST) functionality has been developed in response to demands for lowering the cost of flash memory test.

The BIST batch probe card offers high throughput and low costs for this type of device test.         

Wafer size:	8-inch	12-inch
Minimum probe pitch:	380μm	400μm
Pad size:	75μm or more	85μm or more
Maximum probe count:	8,000	14,000
Operating temperature:	-30 to +85°C
Contact resistance:	1Ω or less
Service life (touchdown count):	100,000 times (at Au-pad)
Repair:	Separate repair for each pin possible