LS Main Frame Features: 

• Configuration based on a small, space-saving mainframe and 52-module slot test head.
• System offers great flexability and expandability since test modules are populated in an as-needed-by-application basis.
• The test head supports two methods of cooling: forced-air and liquid in order to achieve the greatest flexibility of test module mix at unconstrained slots.
• A multi-controller architecture that supports multi-site test is employed in order to achieve high throughput test.
• The device interface features a large layout area that symmetrically distributes many high-speed, high-accuracy pins.
• Richly featured T2000 test modules can be installed to meet your multi-site SoC application.
• Connection can be easily made to a handler, prober and manipulator.
• Low-power consumption design taking into account environmental considerations and reduction of running costs.