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T5503 DDR3 Test System Named a T&MW; Best in Test Finalist
Cast your vote for Advantest by February 18
Advantest sponsors SPIE Lithography Conference
February 21-25, San Jose, CA
Global Semiconductor Forum
March 11-14, Singapore
The Confab 2010
May 16-19
Las Vegas, Nevada
Customers rank Advantest a 10 BEST company
for 21 consecutive years
Committed to the cutting-edge research and development, Advantest employees publish papers on the latest hot issues in testing in the world's premier conferences and journals. These papers present state-of-the-art methodologies and solutions for SoC, embedded memories, high-speed analog/mixed-signal circuits, tester architecture and test development. The concepts described in these papers solve the burning problems and are beneficial to the whole semiconductor industry.
  
In-House Manufacturing Remains a Core Competency at Advantest
  
Demand Spikes for Multi-Site Testing
  
Breaking the Barriers to RF Multi-DUT Tests
  
E-Beam Technology Breaks Through Complex Design Cycles
  
Advantest Boosts Tested Multichip Packages per Hour
  
Navigating the Outsourcing Options
  
Reducing EVM Test Time And Identifying Failure Mechanisms
  
MIMO challenges existing ATE
  
Ultrawideband SoCs pose new challenges to manufacturers
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