ADVANTEST CORPORATION

T5503 DDR3 Test System Named a T&MW; Best in Test Finalist Cast your vote for Advantest by February 18

Advantest sponsors SPIE Lithography Conference February 21-25, San Jose, CA

Global Semiconductor Forum March 11-14, Singapore

The Confab 2010 May 16-19 Las Vegas, Nevada


Customers rank Advantest a 10 BEST company for 21 consecutive years

Committed to the cutting-edge research and development, Advantest employees publish papers on the latest hot issues in testing in the world's premier conferences and journals. These papers present state-of-the-art methodologies and solutions for SoC, embedded memories, high-speed analog/mixed-signal circuits, tester architecture and test development. The concepts described in these papers solve the burning problems and are beneficial to the whole semiconductor industry.

	In-House Manufacturing Remains a Core Competency at Advantest

	Demand Spikes for Multi-Site Testing

	Breaking the Barriers to RF Multi-DUT Tests

	E-Beam Technology Breaks Through Complex Design Cycles

	Advantest Boosts Tested Multichip Packages per Hour

	Navigating the Outsourcing Options

	Reducing EVM Test Time And Identifying Failure Mechanisms

	MIMO challenges existing ATE

	Ultrawideband SoCs pose new challenges to manufacturers

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