Versatile New Test Instrument Reduces Costs and Speeds Time to Market for New ICs
TOKYO, Japan – November 27, 2012 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) has introduced its new T2000 8GDM to address the test requirements of system-on-chip (SoC) devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate (DDR) connections. The new module will be featured in Advantest's exhibit (booth #8C-901 in Hall 8) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.
The T2000 8GDM has the versatility to test a wide range of SoC interfaces while operating at data rates up to 8 Gbps. Key capabilities include clock and data recovery (CDR), jitter injection, I/O dead band cancellation and multi-strobe operation. The module is available in an Enhanced Performance Package (EPP) capable of functional test abstraction (FTA), which can further shorten cycle times and streamline debugging.
“With its higher density and performance, our new T2000 8GDM positions us to capture even more market share in testing complex SoC devices with high-speed interfaces in multi-time domains,” said Dr. Toshiyuki Okayasu, executive officer and executive vice president of the SoC Test Business Group at Advantest Corporation. “Both the FTA and EPP features enable system-level functional testing of these targeted semiconductors.”
Advantest’s module and tester designs are not only high performance, but also reduce test costs and time to market with high-throughput, multi-user environments and concurrent test capabilities – all key performance attributes for overseas production facilities.
Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.