Leading Supplier of Semiconductor Test Equipment Will Showcase Products and Services in Demand by the Chinese Market
TOKYO, Japan - March 7, 2018 - Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature product demonstrations and digital displays on 12 of its advanced products and services for the Chinese semiconductor market at the SEMICON China trade show, coming March 14-16 to the Shanghai New International Expo Centre.
Among the emerging test solutions on display in Advantest’s booth #4425 in Hall N4 will be the T2000 AiR system, designed for testing modules and system-in-package (SiP) devices that integrate MCUs and application processors to perform functions such as telecommunications, power management and sensing. The compact, air-cooled T2000 Air has the flexibility to be used for both low-cost testing in R&D environments and high-mix, low-volume production. It can be integrated with the M4800 series of handlers to create a zero-footprint test cell, which Advantest calls its Integrated Zero Test Station.
Also featured in the booth will be the EVA100 measurement system, an evolutionary value-added platform designed for both digital and analog testing of small-pin-count analog, mixed-signal and sensor ICs used in smart electronics. Capable of being used anywhere from engineering to volume-production environments, the scalable EVA100 allows simultaneous control of multiple test functions to conduct high-precision measurements and improve testing efficiency.
Other leading-edge products on display will include the Airlogger WM1000 wireless data-logging system, which maximizes the efficiency of testing operations and enables temperature measurements of moving objects. These capabilities are especially advantageous in the automotive industry as well as other manufacturing and R&D fields.
Advantest also will showcase its innovative CX1000P CloudTestingTM Service, which offers cost-effective, on-demand test solutions to users working in semiconductor design, electronic component R&D, prototype evaluation, failure analysis and academic research.
The booth will include exhibits of Advantest’s advanced IC test solutions including the V93000 platform, providing the industry’s broadest test coverage for system-on-chip (SoC) ICs, system-in-package (SiP) devices, wafer-level chip-scale packages (WLCSPs), RF-based semiconductors, 3D device architectures and other semiconductor designs. Enhancing the V93000’s performance even further are Wave Scale MX-HR and Wave Scale RF channel cards, which enable unprecedented parallelism and throughput to reduce the cost of testing ICs for today’s wireless communications market in addition to creating a path for testing future 5G devices.
Additional products to be shown include the highly flexible T5830ES engineering station, whose Tester-per-SiteTM design enables it to conduct wafer sorting and final testing across a wide range of flash memory devices used throughout mobile electronics; the TS9000MTA non-destructive semiconductor mold thickness measurement system enabled by terahertz technology; the T6391 tester for LCD drivers with the HiFix enhancement that optimizes test solutions for specific test frequencies and device packages; the portable, remotely operable M4171 handler, capable of automated device loading and unloading as well as active thermal control (ATC); the F7000S e-beam lithography tool for the upcoming 1X-nm technology node; and the extendible B6700 test burn-in system featuring low-power operation.
In addition to its booth exhibit, Advantest will sponsor and take part in the China Semiconductor Technology International Conference (CSTIC) in the “Metrology, Reliability and Testing” symposium on Sunday, March 11 beginning at 13:30 in Meeting Room 5D+5E at the Shanghai International Convention Center. Participants in the forum will include Kenichi Nagatani and Kun Xu of Advantest’s SoC Business Group in China.
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Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.