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2018-03-12 07:05:00.0 Topics

High-Performance Test Platform Will be Used by Beijing-Based Company in Developing Custom ICs for AI Applications

TOKYO, Japan – March 12, 2018 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has installed multiple V93000 Wave Scale RF testers at several outsourced semiconductor assembly and test (OSAT)facilities in China for use by Unigroup Spreadtrum & RDA, a world's leading fabless semiconductor company with advanced technology in mobile communications and IoT. Unigroup Spreadtrum & RDA has made the V93000 Wave Scale platform the tester of choice for its next generation of baseband, radio-frequency system-on-chip (BB RF-SoC) devices.

“This customer is focused on leveraging its IC-design expertise to accelerate deep learning with innovative, cost-effective and energy-efficient solutions,” said Hans-Juergen Wagner, senior vice president, SoC Business Group at Advantest Corporation. “In addition to working with them, Advantest also provides test solutions to companies that manufacture microprocessors, GPUs (graphics-processing units) and custom devices that are used in today’s AI applications. Through our many global partnerships and activities, we are further extending our leadership to provide the best test solutions in this fast-growing market.”

At the SEMICON China trade show, running March 14-16 at the Shanghai New International Expo Centre, Advantest will exhibit 12 of its advanced products and services for the Chinese semiconductor market in booth #4425, Hall N4. An expert in testing chips for AI applications will be available in the booth to talk with visiting customers. In addition, product displays will include the V93000 platform, which provides the industry’s broadest test coverage for leading-edge semiconductors. When equipped with Wave Scale MX and Wave Scale RF channel cards, the V93000 can achieve unprecedented parallelism and throughput, reducing the overall cost of test and pioneering new capabilities to test future generations of IC designs.

Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.