News News

Apr 3, 2018 Topics

Leading Supplier of Semiconductor Testers Will Feature in its Exhibit Booth the HA7200 Temperature and Pressure Controller for Enhanced Sensor Testing

TOKYO, Japan – April 3, 2018 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will exhibit its innovative test solution for semiconductor-based pressure sensors used in advanced driver-assistance systems (ADAS) and moderate a panel discussion on the evolving appearance and operation of automobiles at SAE’s WCX World Congress, coming April 10-12 to Cobo Center in Detroit, Michigan.

Rugged, on-board sensors are in high demand for automotive applications, where their usage ranges from reducing carbon-dioxide emissions to enabling ADAS-enabled vehicles. Ensuring the reliable performance of these sensors and shortening the development time for new automotive systems requires highly efficient test solutions.

In booth S4000 throughout the WCX World Congress, Advantest will exhibit its HA7200 system, capable of precisely controlling the temperature and pressure in testing automotive pressure sensors. Designed for evaluating up to four sensors simultaneously, the HA7200 can be coupled with a handler and the EVA100 measurement system to create a high-productivity test cell that optimizes a user’s engineering, prototyping and manufacturing processes. This test cell is already in use at multiple customer companies.

In addition, Advantest’s vice president of global marketing communications, Judy Davies, will moderate a roundtable discussion with seven automotive industry executives sharing their insights and opinions regarding how new generations of electronics, hardware, software, system architectures and manufacturing processes are changing the automobile industry. The 90-minute event will begin at 9:00 a.m. on Thursday, April 12, in the Ambassador Ballroom, Room #360 of the Cobo Center.

Stay informed about all of Advantest’s global market activities by following the company on Twitter @Advantest_ATE.

Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.