Advantest Developer Conference Expands to Shanghai, China in May 2015
Tokyo, Japan – Oct. 16, 2014 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) has issued a VOICE 2015 international call for papers focusing on innovative test solutions for system-on-chip (SoC) and memory semiconductor devices and handler solutions. VOICE, the annual Advantest Developer Conference, will include technical presentations, a partners’ expo, and interactive discussion sessions for users of the V93000 and T2000 SoC test platforms as well as Advantest memory testers, handlers and test cell solutions, offering comprehensive learning and networking opportunities for all attendees.
For the past nine years, VOICE has brought together perspectives and expertise from all over the globe. The 2015 conference will return to the Hyatt Regency Santa Clara, in California’s Silicon Valley, from May 12-13, with an additional workshop day on May 14 at Advantest’s San Jose office. Furthermore, VOICE will expand internationally for the first time with an exclusive, one-day event in Shanghai, China on May 22, providing VOICE attendees and partners the opportunity to engage with an even larger international group in the Asia region.
“The VOICE Developer Conference continues to grow and improve upon prior years by listening to our attendees,” said Carl Duffy, test engineering manager at Freescale Semiconductor. “In 2015, we are expanding the scope of the call for papers to include more of the hottest industry topics, and adding an event in Shanghai, China, an important global market. VOICE is a great opportunity to discuss specific test challenges, learn new methodologies, and network with engineers and other industry experts from the world’s top semiconductor companies. The paper selection committee includes many Advantest customers, who are the developers using Advantest systems daily in their business. I am pleased to be the Chairman of VOICE 2015 and look forward to working with Advantest staff and our industry peers to put together a great conference.”
Each year, VOICE attracts hundreds of attendees from leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsource assembly and test (OSAT) houses.
The VOICE 2015 call for papers will focus on seven technology tracks covering:
Device Specific Testing
Techniques for testing MPUs, MCUs, ASICs, automotive, CMOS imaging, sensors, PMICs, memory, multi-chip packages, stacked die, and more
Hardware Design and Integration
Tester/handler integration, probe and package loadboard design, challenges of new package technologies and fine pitch devices, and more
Test time reduction, increased multi-site, multi-site efficiency, concurrent test, and more
DFT, pattern simulations/cyclization, automatic test program generation, system-level test, and more
New HW/SW Test Solutions
Solutions utilizing the latest hardware or software features
Techniques for testing DC, RF, mixed signal or high speed digital devices
Timely topics covering test program quality control, security and encryption, production outsourcing, emerging wireless standards, test challenges at sub-28nm nodes or other subject matters trending in the ATE industry
Test developers can submit their abstracts to be presented at either the Santa Clara or Austin locations, or both. To respond to the call for papers and for more paper ideas, go to www.advantest.com/voice. All submissions must be received by November 21, 2014, and accepted presenters will be notified in January 2015.
Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.