Advantest to Sponsor and Present at the First SEMICON Korea 2021 Virtual Conference

2021/02/02 Events

TOKYO, Japan – February 2, 2021 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will participate in the first SEMICON Korea 2021 virtual conference on February 3-5, 2021. The exhibition portion of this year's event has been cancelled due to the recent increase of COVID-19 cases.

Advantest is a Platinum sponsor and will deliver a virtual presentation during the Smart Manufacturing Forum. Kyoungyong Kang, leader of the SoC UI Team for Advantest Korea, will present "Test Cell Management for Enabling SMART Manufacturing." In this session, Kyoungyong will discuss how to quickly adapt to Smart Manufacturing ("Industry 4.0") with smart test cell management solutions that can contribute to maximizing Overall Equipment Effectiveness (OEE) and improving overall quality.

Social Media

For the latest updates, check out the Advantest Facebook and LinkedIn page or follow @Advantest_ATE on Twitter for live tweets during events.

About Advantest Corporation

Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more.  Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world.  The company also conducts R&D to address emerging testing challenges and applications, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools.  Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.  More information is available at www.advantest.com.

Note: All information supplied in this release is correct at the time of publication, but may be subject to change.