The latest PCIe 5.0 is enabling higher data transfer rates and promise to boost the performance new generation of devices.
With higher speed and performance NVMe SSDs, more heat dissipation are expected on the controller and components on the SSDs.
Therefore, in order to precisely validate and test Gen5 SSDs in a better controlled environment, Advantest is offering an Engineering Thermal Chamber to handle reliability thermal cycling of SSDs.
Integrated with MPT3000 Gen5 ES3 system, the Engineering Thermal Chamber can precisely control temperature up to ±3ºC over a temperature range from -10ºC to +85ºC.
This full turn key solution, enables you to optimize lab space and test more efficiently, whether it is for burn-in, baking or thermal cycle testing.
Engineering Thermal Chamber is designed to handle all types of form factors, ranging from M.2 to U.3, AIC adaptor as well as EDSFF.
