Microfabrication Technologies Honed in SPE Industry Power Company's Push into New Markets
TOKYO, Japan, - October 22, 2013 - Advantest Corporation (TSE: 6857, NYSE: ATE) today announced that it has logged its first three orders for its new EB (electron beam) lithography system, the F7000, from the University of Tokyo, the University of Kyoto, and a semiconductor industry customer. The systems will be shipped within the fiscal year ending March 2014.
The F7000 Series utilizes electron beams to write fine-pitch patterns directly onto substrates. It offers best in class levels of throughput at the 1Xnm node, where semiconductor R&D demand is now focused. The system's self-cleaning function ensures stable performance over long periods, while the adjuster function enables support for substrates of diverse sizes, shapes, and materials.
The customers who have ordered the F7000 Series at this time plan to use the system for R&D in the fields of MEMS/NEMS (non-electro-mechanical systems), biochips, new devices, and electronic components, in addition to research into semiconductor wafers and other forms and types of substrate. The orders mark a milestone in Advantest's strategic expansion into new markets where its cutting-edge EB microfabrication technologies can contribute to further advances in next-generation device research and development.
F7000 Series EB Lithography System
Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.