When it comes to board-to-board interconnectivity, reliability and versatility are key. Our Invisipin® Board to Board Interconnect provides just that, offering a highly configurable and robust solution that accommodates digital, power, and RF on the same array. It even features an air dielectric option for high-speed/RF applications.
Imagine a world where your board-to-board connections are no longer a bottleneck but an enabler of seamless performance. That's the power of Invisipin® Board to Board Interconnect. It's not just a product but a pathway to unparalleled performance and technological innovation.
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Highly Configurable – Custom Pad / Array Configurations Available
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Mixed Digital, Power, RF on Same Array
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Double the Compliance of a Single Pin
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Air Dielectric Option for Hi-Speed / RF
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Unparalleled Performance
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< 1dB loss @ 65GHz
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Up to 4 Amps continuous
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Ultra-Low Loop Inductance
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Environmental -40℃ to +150℃
Invisipin® Board to Board Interconnects provide a solution for a separable connection between system hardware elements and replaceable modules. They also enable a path to connect PCBs to similar PCBs or ones having dissimilar materials or construction. Since Invisipin® Board to Board Interconnects do not require soldering, they are easy to install and are compatible with temperature sensitive elements.
