Substrates (including Multi-Layer Organic)
Experience unparalleled performance with our cutting-edge Ultra Fine Pitch Interposers designed specifically for wafer testing. Engineered to guarantee high-speed and exceptional Power Delivery Network (PDN) performance, these interposers enable higher parallelism and support multi-DUT testing.
Our advanced interposers boast an impressive 25µm to 200µm pitch range, accommodating the most demanding applications. In addition, our commitment to industry-leading cycle times ensures rapid turnaround, empowering our customers to stay ahead in the competitive semiconductor landscape.
Explore the benefits of our Ultra Fine Pitch Interposers and elevate your wafer testing capabilities to new heights.
