High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs
Today's semiconductors are gaining in complexity both in circuit design and packaging, and continue to be challenged by high-volume applications that function in environments with wide-ranging temperature fluctuations. Semiconductor test and handling equipment must evolve to meet these requirements, in the same way it must adapt to increasing demands for higher parallelism and higher throughput.
Unique in its class, Advantest's new M4841 Test Handler enables high-throughput parallel test for very high volumes of devices and supports complex ICs and packages, including BGA, CSP and QFP. Because of its advanced performance capabilities and features, the M4841 is the optimal test handler for high volume production of devices used in consumer products such as portable digital equipment and automotive systems.
Reduced Cost of Test
The M4841 is capable of parallel test of up to 32 devices, four times the capability of the earlier, industry-leading handler, also from Advantest. The M4841 also delivers a high throughput of 18,500 devices per hour. With three times the throughput capacity of its predecessor, the M4841 sets a new standard for the industry. Because of its high test efficiency, the M4841 is well-suited for high-volume production lines. With its unprecedented combination of 16-device parallel test and 18,500 device-per-hour throughput at 3 seconds test time or less, the M4841 makes a substantial contribution to reduced cost of test.
Supports Test Across Wide Temperature Range
The M4841 maintains a constant temperature and devices can be cooled to -40°C or heated to 125°C (Optional: -55°C to +175°C). This wide temperature range ensures that the M4841 can be used to simulate device application environments with severe temperature ranges, such as those experienced in automotive or avionics. By minimizing the effects of heating or cooling upon throughput, the M4841 offers consistently high speeds and performance, even at temperature extremes.
Modular Structure
The M4841 maintains a constant temperature and devices can be cooled to -40°C or heated to 125°C. This wide temperature range ensures that the M4841 can be used to simulate device application environments with severe temperature ranges, such as those experienced in automotive or avionics. By minimizing the effects of heating or cooling upon throughput, the M4841 offers consistently high speeds and performance, even at temperature extremes.
ATC2.0
Integrates high-speed sensing technology for internal device temperature and heating/cooling system that has excellent responsiveness, dynamically adapting to temperature changes in the device.
By performing high load-following characteristics in response to fluctuations in heat generation during testing, it maintains the set testing temperature, thus providing a highly consistent testing environment.
In a stable testing environment, customers can build test programs with greater flexibility, leading to significantly improved productivity across the entire testing process.
