Unified, Scalable Test Platform for Power Semiconductor Devices
MTe is the first unified test platform that covers all the power semiconductor testing requirement from wafer to the complex assembled modules.
Designed with state-of-the-art Advantest technology, MTe provides significant footprint reduction and optimized resource distribution without performance degradation; a key enabler for Integrated device manufacturer (IDM) and Outsourced semiconductor assembly (OSAT) players.
Flexible Platform Spans from Wafer to High-End Power Module Testing
The MTe platform is able to address emerging wide-bandgap semiconductor (e.g., Silicon carbide (SiC) and Gallium nitride (GaN)) challenges, as well as the integration of digital IP cores on power devices (e.g., Intelligent power module (IPM) and Integrated power device (IPD)), providing high bandwidth capture instrument, best-in-class gate driver control, dynamic (and short-circuit) test up to 10kA, and flexible high-voltage digital capabilities.
Aligned with Advantest's history of providing scalable test platforms, MTe distributed computing architecture provides significant multisite test efficiency, enabling a high-parallel-test solution with optimized throughput.
Advantages and Benefits
Unified Power Test Platform
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Replace multiple legacy testers with a single scalable system.
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Support both DC and AC power testing with high current and high voltage test capabilities.
Modular & Scalable Architecture
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Modular racks allow flexible and upgradable configurations.
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Support parallel sequential and alternate testing, with full digital synchronization.
Software & Test Efficiency
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MTe software enables machine-independent test development, simulation, and debugging.
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The software technology optimizes the tester resources distribution to provide the best test efficiency.
High Integration & Compact Footprint
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Significant footprint reduction compared to traditional setups.
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Designed for turnkey automation & compatibility with various handler/prober.
Advanced Test Capabilities
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AC Scalable Power Solution (ACSPS) supports up to 10kA short-circuit testing.
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High-speed digitizers and floating probes for SiC and GaN device testing.
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Can be configured with digital resources to meet IPM test requirements.
IP Protection & Market Readiness
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Designed to meet OSAT enablement, IP protection, and cost reduction needs.
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Support wafer sort, KGD, substrate, and module testing in a single platform.
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Optimized for high-throughput and low-CAPEX transitions.
| MDC-8 | MDC-32 | TCAB | MAC | |
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| Width | 400 mm / 19.7" | 650 mm / 25.6" | 730 mm / 28.7" | 800 mm / 31.5" |
| Length | 500 mm / 15.7" | 850 mm / 33.6" | 780 mm / 30.7" | 800 mm / 31.5" |
| Height | 250 mm / 9.8" | 610 mm / 24.0" | 650 mm / 25.6" | 950 mm / 37.4" |
