Next-Generation Handler M5241:
Meeting the Demands of the Evolving Memory Market
With the rapid expansion of AI and data center demand, testing environments for memory ICs such as DRAM, NAND, and HBM require higher precision, efficiency, and reliability than ever before.
Besides, in high-volume package testing lines, new requirements have emerged, including high-precision temperature control and stable long-duration operation.
The M5241 is a state-of-the-art handler developed to address these challenges.
Challenges in Mass Production Lines
Conventional handlers have faced bottlenecks in temperature control accuracy and downtime due to JAMs, making it difficult to ensure productivity and reliability.
Additionally, responding to automation of manufacturing lines and improving maintenance efficiency has become an urgent issue.
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Precision: Industry-leading temperature control achieved through a microchamber system. Enables stable evaluation of next-generation memory devices with significant self-heating.
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Uptime: Proprietary sensing technology and transport error prevention mechanisms drastically reduce JAMs, maximizing test line productivity.
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Maintainability: Maintenance workload is minimized through adjustment-free operation and a one-touch change kit system that requires no mechanical jigs.
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Scalability: Supports smart factory integration with OHT/AMR compatibility, active thermal options, and predictive maintenance via HM360 software.
High-Precision Temperature Control
Achieves ±1.0°C accuracy using a microchamber system, enabling precise testing of high-density memory devices.
Improved Uptime
Reduced JAM occurrences and enhanced maintainability elevate production test line uptime to industry-leading levels.
Broad Tester Compatibility
Supports vertical connection with the new tester T5801 as well as existing models T5833, T5503HS2, and T5835.
Wide Application Range
Optimized for mass production testing of DRAM, NAND Flash, and HBM.
| Docking Method | Vertical Dock |
|---|---|
| Max Device Size | 14 × 22 mm |
| Parallel Test Sites | Up to 512 devices |
| Max Throughput | 46,000 UPH |
| Temperature Range | Standard: -40°C to +125°C / Extended: -55°C to +150°C |