Device Specific Test Solutions
The 7038 is a standardized test platform used by multiple customers therefore much of the existing system can be leveraged for your application. Advantest Test Solutions works with you to migrate your device application board into the 7038 socket interface board form factor to take advantage of the massive parallelism, software, automation, thermal capabilities, and manufacturing expertise. This can either be part of a turnkey solution for that migration or you can choose to own parts of that development depending on your timeline and budget.
A Breadth of Capabilities
Our integrated team of semiconductor test innovators can deliver a complete system tailored to achieve your specific objectives, incorporating:
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Test strategy
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Hardware design
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Socket design and selection
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Software development and integration
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Manufacturing
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Installation
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Program management
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Ongoing support
We are vertically integrated, with electrical design, mechanical design, software design, machine shop, and test engineering all under one roof. Additionally, time-proven processes in program management, supply chain control, configuration management, quality procedures, and testing support delivery of your system on schedule.
Engineer-to-Engineer Collaboration
We work from an "engineer to engineer" philosophy, where our engineering team serves as an extension of yours. We collaborate closely throughout the design process, during system install, and then with support and maintenance.
Your goals are our goals, and this tight collaboration ensures you receive a solution that meets your target of test function, throughput volume, and other important parameters.
Extensive Semiconductor Industry Experience
Whether you need a design verification system or a production-level tester, we are your experienced partner delivering your systems with the strictest confidentiality.
We'll work with you to support your semiconductor on the 7038 platform for an assortment of device and test technology methods including:
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Devices: application processors, CPUs, baseband processors, MCUs, and others
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Testing types: system level, burn-in, or structural test
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Technology: mixed-signal, RF, memory, burn-in, high speed interfaces, and others
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Packages: single device, SiP, PoP, and more
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Applications: consumer electronics, mobile devices, automotive, higher power compute, artificial intelligence, and other industries
