Enabling High-Volume SiPh and NPO/CPO Production
In collaborating with leading industry partners, Advantest combines its industry-leading ATE platform with expertise from across the value chain to deliver scalable, production-ready solutions for electro-optical testing.
Our approach enables customers to:
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Access a fully integrated, scalable test cell concept that meets HVM standards
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Improve test coverage and throughput
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Achieve fully automated wafer-level optical and electrical testing
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Reduce production costs
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Increase product quality through calibrated setups at FAU level
Key Challenges and Solutions
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Optical Probing:
Silicon photonics devices require precise, stable, and repeatable optical access during wafer- and die-level test, creating challenges for optical probing. Advantest collaborates with ecosystem partners to deliver integrated optical probing solutions optimized for high-volume manufacturing. -
Optical Package Fiber Connector Handling:
At final test, packaged SiPh-based NPO and CPO devices require automated optical connections, but the industry lacks a standardized connector. Advantest is well-positioned to leverage its expertise in manufacturing handlers, sockets, and load boards to develop scalable automated solutions for optical package testing. -
Optical Instrumentation:
To meet the diverse needs of our customers, Advantest has integrated external optical test rack instrumentation into the V93000 EXA Scale platform, allowing customers to control optical instruments directly through Advantest’s SmarTest software ecosystem. Moreover, with the V93000 EXA Scale, users have access to the entire portfolio of instruments that the V93000 EXA Scale has to offer.
As the leading ATE platform for AI and HPC semiconductor devices, Advantest’s flagship V93000 EXA Scale platform provides the flexibility and performance required to meet the challenges of next-generation electro-optical device testing. Moreover, Advantest continues to strengthen partnerships across the semiconductor supply chain, including collaborations with leading probe card vendors as well as wafer, die, and packaged-device probing and handling equipment companies to overcome these challenges and continue providing customers with best-in-class test solutions for high-volume manufacturing.
