Advantest to Showcase its Broad Spectrum of Semiconductor Test Solutions at SEMICON West, July 12-14 in San Francisco

Leading Test Equipment Company Will Display New Products in its Booth and Present Three Technical Papers at This Year's Show

SAN JOSE, Calif. – July 11, 2016 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature more than a dozen of its most advanced test solutions and present three technical papers at the SEMICON West 2016 trade show on July 12-14 at Moscone Center in San Francisco.

"We offer leading-edge, cost-efficient test solutions for all types of ICs, from highly integrated SoC (system-on-chip) devices to high-volume memories and everything in between," said Judy Davies, vice president of global marketing communications at Advantest. "With our wide range of technologies, we can help our customers measure the connected world and everything in it."

Product Displays

This year, Advantest's booth #5852 in North Hall will feature the debut of three new modules for the V93000 single scalable platform. The new Wave Scale RF and Wave Scale MX cards enable the V93000 to achieve unprecedented levels of parallelism and throughput in testing radio-frequency (RF) and mixed-signal ICs for wireless communications, reducing both the cost of test and time to market. The DC Scale AVI64 universal analog pin module gives the V93000 platform the industry's broadest capabilities for testing power and analog ICs used in mobile applications.

Also being highlighted in the booth will be two SoC test solutions – the highly flexible T2000 platform, which gives customers access to high-volume markets with minimal investment, and the EVA100 tester for digital and analog testing of small-pin-count semiconductors.

Customers in the memory IC market will be interested in the display on the high-productivity T5830 memory tester, offering low cost of test for virtually any Flash memory.

To meet the needs of the growing solid-state drive (SSD) market, Advantest will showcase its MPT3000 system, designed for rapid development and production ramp up of SSD designs.

A large digital display will feature the HA1000 die-level handler for probing individual dies, unpackaged 3D stacks and 2.5D devices.

In addition, Advantest will showcase other offerings including the company's TAS product family of terahertz analysis systems that enable spectroscopic imaging and measurements; nanotechnology E-beam lithography for nano-patterning and MVM-SEM® for nano-scale measurement; the EM360 dashboard, enabling complete test-floor management and planning; the M6245 and M4871 handlers that boost testing productivity; Advantest's innovative CloudTesting™ Service for on-demand testing; and specialty products such as the MicroLTE portable test system and SmartBox™, a diagnostic test solution for mobile communication devices from W2BI, Inc., a member of the Advantest Group of companies.

Paper Presentations

In addition to product exhibits, Advantest technologists will present three technical papers, all on Wednesday, July 13. In the Test Vision 2020 program in Room 131 of Moscone Center's North Hall, Advantest's Derek Floyd will present his paper on "New ATE Solutions for Upcoming Analog Test" at 11:40 a.m. and Advantest's Dave Armstrong will discuss how "Thermal Testing of Singulated Devices Gets Us Closer to Known-Good Die/Stack" at 2:50 p.m. That same afternoon at 2:20 p.m. in the technical session on Analog and New Frontiers on the keynote stage in North Hall, Advantest's Takahiro Nakajima will speak on "Test Challenges for Future Automotive 100M/1Gbps Ethernet PHY."

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Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.