Advantest Introduces Two New Systems in its B6700 Series of Memory Burn-In Testers for NAND Flash Memories

New B6700L Tester Expands the Platform’s Temperature Range While B6700S System Offers Zero-Footprint Configuration

TOKYO, Japan – October 24, 2018 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has launched two additional members of its next-generation B6700 family of burn-in memory testers. The new B6700L and B6700S models are designed to lower the cost of test while boosting the parallel testing capacity for NAND flash memories now in high demand for server and mobile data-storage applications.

“By expanding the breadth of products in our B6700 series, we are offering the global market greater flexibility to address the expected tripling of NAND storage capacity over the next few years,” said Takeo Miura, vice president of Memory ATE Business Group at Advantest. “Our two new high-volume test solutions will help customers get more return from their capital investments while retaining the ease of connecting to their existing production networks.”

The initial system in the series – the recently announced B6700D – is designed for highly parallel, low-cost testing of next-generation memories by evaluating the functionality of NAND flash devices during burn-in. Many of the system’s key features are doubled compared to its predecessor, including twice the driver-pin resources and power-supply capacity as well as a two-chamber design.

The new B6700L tester has the same resources as the B6700D while accommodating a wider temperature range. The ability to perform temperature-controlled testing from -40° C to 150° C in one-tenth of a degree increments makes this system well suited for reliability and automotive-device testing. The B6700L also can simultaneously test up to 12 B6700D-compatible burn-in boards (BIB) and test programs.

The new zero-footprint B6700S system offers a dramatically lower-cost test solution for NAND flash memories while offering the same capabilities as its sister systems. The B6700S offers a unitized function of the B6700D and can be embedded within a multi-wafer probing system used in individual wafer-level testing, avoiding any costs associated with occupying floor space in lab or production environments.

All members of the B6700 product family use the same tester boards and operating system, giving them universal compatibility. Bad block memory (BBM), universal buffer memory (UBM) and data pattern memory (DPM) functions are supported to enable NAND device testing.

The new B6700L and B6700S testers are scheduled to begin shipping to customers in the first quarter of calendar 2019.

B6700L                                                                    B6700S

Note: All information supplied in this release is correct at the time of publication, but may be subject to change.