Memory Burn-in Test System
With the semiconductor memory market expected to grow
significantly in the future, chip makers require a fast,
high-volume burn-in test solution to keep pace with their
customers' growing demand.
B6700 series fulfills this
need by testing multiple burn-in boards in parallel at
speeds up to 10 MHz.
Also by incorporating the memory
test function that we have cultivated over many years, it
can run test while burn-in, and the testing process can be
improved.
B6700
B6700 can test as many as 48 burn-in boards in parallel at
speeds up to 10 MHz, which helps memory suppliers get their
newest products to market faster while also reducing testing
costs.
An original high performance chamber improves
yield by assuring high temperature accuracy while generating
high temperature.
It also shortens the temperature rise
and fall time which leads to shortening the test time.
B6700ES for engineering purpose
B6700ES incorporates all capabilities of the B6700 into a
smaller configuration for engineering purpose.
It
contributes to a reduced TAT (turn around time) from R&D to
device production.
B6700S for zero-footprint configuration
B6700S system offers a dramatically lower-cost test solution for NAND flash memories while offering the same capabilities as its sister systems. The B6700S can embed a measurement function of the B6700 within a multi-wafer probing system used in individual wafer-level testing, avoiding any costs associated with occupying floor space in lab or production environments.