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2014-09-03 00:00:00.0 Topics

Advantest Lauded for its Test Equipment’s Flexibility and Role in Making Customer Successful

TOKYO, Japan – September 3, 2014 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) has again won the annual Outstanding Award in Service and Support from STATS ChipPAC Ltd. (SGX-ST: STATSChP), a global leader in advanced semiconductor packaging and test services.  This latest recognition extends Advantest’s streak of receiving an award each year since 2007, when STATS ChipPAC began honoring its suppliers for their performance and service.

This award recognizes equipment and materials suppliers that provide excellent service, support and responsiveness, thereby demonstrating their alignment with STATS ChipPAC’s technology roadmap for the long-term success of the outsourced semiconductor assembly and test (OSAT) company and its customers.

“The strong relationship we have with Advantest is vital to our business and we appreciate the tremendous support we have received throughout the past year,” said Cindy Palar, senior vice president of strategic operations at STATS ChipPAC, in presenting the award last month in Singapore.  “The ability to reconfigure and deploy Advantest testers quickly and efficiently has been a key advantage in responding to our customers’ business requirements.  Advantest’s excellent delivery, performance, flexibility and responsiveness to urgent upsides have made the company a strong strategic test partner.”

“We are very proud of our long and mutually successful partnership with STATS ChipPAC,” said Shinichiro Kuroe, president, chief executive officer, and representative director of Advantest Corporation.  “Advantest is committed to providing all of our customers with innovative test solutions that deliver superior efficiency and cost effectiveness.”

 

Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.