Booth Exhibits and Paper Presentation Address SSD Testing from Engineering to Volume-Production Environments
SAN JOSE, Calif. – August 5, 2015 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) will exhibit its MPT3000 family of test solutions for advanced solid state drives (SSDs) and present a technical paper at the Flash Memory Summit, August 11-13 in Santa Clara, Calif. Advantest is an Emerald sponsor of this year’s tenth annual Summit.
Highlighted Products in the Booth
Designed to help accelerate SSD product development and achieve faster time to market, Advantest’s flexible, multi-protocol MPT3000 platform will be featured in booths #606-608 within Hall B of the Santa Clara Convention Center during the Summit’s exhibition days of August 12-13.
The MPT3000ENV leverages its modular, tester-per-DUT architecture to conduct performance and stress testing of PCIe NVMe, SAS 12G and SATA SSDs of all major form factors in a thermal chamber supporting up to 6.4kW total DUT power dissipation. This tester gives customers the adaptability to compete in the evolving SSD market.
Advantest’s MPT3000ES engineering station uses the same high-performance electronics and software as the MPT3000ENV, but offers a smaller footprint configuration. The engineering station can perform analysis and debugging on a wide range of SSD products enabling device manufacturers to pursue multiple business opportunities with a single test platform. Live demonstrations of the MPT3000ES testing devices of multiple protocols will be shown in the booth.
In addition to its exhibits, Advantest will present a paper on testing SSDs. Speaker Scott Filler, marketing manager at Advantest, will discuss the cost of test for SSDs during the F-21 Forum. This forum will be held in the Great America Ballroom J at the Santa Clara Convention Center on Wednesday, August 12, beginning at 8:30 a.m.
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Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.