There are 8 pcs of RFID AMOs on one wafer PB. Each RFID AMO consists of two sites. Each site can provide input signals to 4 DUTs via 4 relays and output signals to the tester. Therefore, one wafer PB can support 64 DUTs in parallel.
T2000 RFID AMO Specification (Two in one)
Layers
8
Thickness
1.6 mm
Number of sites
2
Signal amplification
7.25 (Changeable by resistor and capacitor values)
T2000 RFID AMO Solution (Four in one)
There are 16 pcs of RFID AMOs (Application Modules) on one wafer PB. Each RFID AMO consists of four sites. Each site can provide input signals to one DUT and output signals to the tester. Therefore, one wafer PB can support 64 DUTs in parallel.
T2000 RFID AMO Specification (Four in one)
Layers
14
Thickness
2.1 mm
Number of sites
2
Signal amplification
4.19 (Changeable by resistor and capacitor values)