Equipped with ATC function to handle high heat during testing of AI and HPC (GPU and CPU) devices.
In recent years, the market for AI and HPC devices has been expanding rapidly, with a significant increase in demand for GPUs and CPUs tailored to these purposes.
Furthermore, it also incorporates stable and flexible force control technology to address the multi-pin configuration of devices, with a consideration for protecting the testing devices.
Active Thermal Control
Advantest cutting-edge technology, "ATC 2kW," with its high-capacity heating and cooling capabilities provide a highly consistent testing environment by maintaining the desired testing temperature requested by customers even for devices generating high heat during testing. Additionally, controlling high heat generation increases the flexibility of test items, expanding our customers' options in test programs.
Die Force Control
Control the contact force separately for the device die area and its surrounding area. This technology prevents warping or cracking of the device, thus avoiding a decrease in yield.
Also, it applies appropriate contact force to the device die area and increase adhesion between the device and the Pusher equipping with temperature control functionality. This technology aims to enhance thermal conductivity, then achieving stable temperature control.