WAFER MVM-SEM® E3300 Series


Multi Vision Metrology SEM supports next-generation wafers

The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.

*: MVM-SEM = Multi Vision Metrology Scanning Electron Microscope

  • Advanced electron-optical column design for high resolution measurement
  • Supports evolving wafer processes such as 3D measurement
  • 3D topography imaging
  • High Stable, Fully Automatic Image Capture
  • Supports evolving wafer processes
  • Rich range of applications

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* MVM-SEM is either a registered trademark or a trademark of Advantest Corporation in Japan, the United States and other countries.