IC Test Equipment Leader Will Debut Two New Products, Exhibit a Wide Range of Proven Test Solutions and Sponsor a Technology Forum
TOKYO, Japan – December 6, 2017 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will present the industry's most advanced and innovative test solutions for measuring the connected world at SEMICON Japan 2017 on December 13-15 at Tokyo Big Site in Tokyo, Japan.
"This year, we are showcasing our industry-leading array of advanced IC test solutions, emerging technologies and wafer-metrology systems, all designed to deliver high-end performance while reducing the cost of test for our customers around the world," said Judy Davies, vice president of global marketing communications for Advantest. "As the semiconductor industry works to bring IoT into our everyday lives, our broad end-to-end product portfolio has been critical in enabling electronics for a digital experience."
Booth #2045 in Hall 2 will house exhibits of Advantest's newest test systems including the T2000 test modules MMXHE and MFHPE for high-power devices used in the power trains of electric vehicles and the M4171 automated IC handler featuring active thermal control (ATC) and remote operating capability.
Also on display will be the EVA100 measurement system for production-volume testing of analog, digital and mixed-signal devices; the compact T2000 AiR system, featuring a test cell for high-mix, low-volume system-level testing of IoT devices; the flexible MPT3000 series of testers for solid-state drives (SSD) and the company's innovative CloudTesting™ Services.
Other advanced IC test solutions in this year's exhibit will include the V93000 Wave Scale platform with its enabling MX-HR and RF modules, the T5503HS tester for next-generation memory ICs used in mobile applications and servers, the T5830 and T5833 systems designed to serve the booming market for 3D NAND Flash memories and the T6391 system for testing display driver ICs (DDI).
Wafer-metrology solutions to be displayed include the F7000 e-beam lithography tool, capable of meeting resolution requirements for 1X-nm technology nodes, and the TS9000 series of terahertz analysis systems for measuring IC mold thickness and the wiring quality of IC packages and printed circuit boards.
Additional exhibits will highlight probe cards, field-service capabilities and financing and leasing services.
In addition to its booth exhibit, Advantest will sponsor and take part in an IoT technology forum on "The Dawn of the Smart Automotive Era" on December 14 beginning at 3:10 p.m. in Reception Hall A in the Conference Tower. Participants in the forum will include Kotaro Hasegawa of Advantest's ADS Business Group as well as executives from Hitachi Automotive Systems, Nissan Motor Company and nVidia.
Connect on Social Media
To keep up to date on all of Advantest's activities, follow the industry leader on Twitter @Advantest_ATE.
Note: All information supplied in this release is correct at the time of publication, but may be subject to change.