Highly-parallel, multi-site, T2000 SoC test platform offers cost effective solution and gives Bay Area fabless companies a path to volume production
SANTA CLARA, Calif., December 7, 2009 -- Advantest Corporation (TSE: 6857, NYSE: ATE), global leader in automatic test equipment (ATE) solutions to the semiconductor industry, today announced that STATS ChipPAC Ltd. (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, has installed a T2000 SoC test system in its facility in Milpitas, California. The installation is part of an expanding global partnership between the two companies. Advantest’s T2000 SoC test platform offers the industry’s highest levels of multi-site and parallel testing capabilities, helping to speed time-to-volume economics for the broadest range of SoC devices including: graphics processors, RF SoC, cellular RF and digital baseband, power management and audio/video devices. The installation at STATS ChipPAC Test Services provides system access to Silicon Valley’s growing number of fabless companies and offers a gateway to volume production at STATS ChipPAC’s facilities in Asia.
The T2000 is a next generation SoC architecture featuring a loadboard user space more than 5 times larger than competing alternatives and the industry’s most advanced control architecture for the fastest test times, both at today’s multisite levels and for future expanded site counts. Capable of addressing the unique requirements of today’s complex digital MPUs as well as consumer and wireless devices, the T2000 offers superior integration of high-channel density analog, DC and RF instrumentation and the industry’s lowest cost digital instruments from 50Mbps through 6Gbps.
“STATS ChipPAC prides itself on its ability to provide customers with access to advanced test platforms, proven test processes and top notch engineering support. Now, with the addition of Advantest’s T2000 to our US test floor, Bay Area companies can take advantage of the system’s industry-leading test times and parallel efficiency. Our goal is to help our customers turn their test engineering investments into cost advantages as their devices migrate into volume production,” commented Mark Kelley, STATS ChipPAC Test Service’s general manager.
Mark Byars, Advantest’s senior director of U.S. fabless/OSAT sales stated, “Advantest values STATS ChipPAC as a strategic partner worldwide. Whether at probe or final test, the uncompromising efficiency of the T2000 delivers high quality, technologically demanding test flows with volume economics that drive the cost curve across the industry’s broadest range of SoC devices. Together STATS ChipPAC and Advantest deliver a high-confidence, cost-efficient process flow with rapid time-to-volume.”
A formal introduction of the system will take place on December 10, 2009 during a luncheon hosted by Advantest at the STATS ChipPAC Test Services facility. For more information on the event or to reserve a seat at the luncheon, please contact firstname.lastname@example.org.
About STATS ChipPAC
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.
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