B6700 Series

Memory Burn-in Test System

With the semiconductor memory market expected to grow significantly in the future, chip makers require a fast, high-volume burn-in test solution to keep pace with their customers' growing demand.
B6700 series fulfills this need by testing multiple burn-in boards in parallel at speeds up to 10 MHz.
Also by incorporating the memory test function that we have cultivated over many years, it can run test while burn-in, and the testing process can be improved.



B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs.
An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature.
It also shortens the temperature rise and fall time which leads to shortening the test time.


B6700ES for engineering purpose

B6700ES incorporates all capabilities of the B6700 into a smaller configuration for engineering purpose.
It contributes to a reduced TAT (turn around time) from R&D to device production.


B6700S for zero-footprint configuration

B6700S system offers a dramatically lower-cost test solution for NAND flash memories while offering the same capabilities as its sister systems. The B6700S can embed a measurement function of the B6700 within a multi-wafer probing system used in individual wafer-level testing, avoiding any costs associated with occupying floor space in lab or production environments.