TS9000 Series MTA Option (Mold Thickness Analysis) TS9000 Series MTA Option (Mold Thickness Analysis)

  • Non-Destructive Semiconductor Mold Thickness Measurement Enabled by Terahertz Technology
  • User-Friendly High-Speed Automatic Measurement Ideal For High Volume Manufacturing Environments
  • ±3µm Layer Thickness Measurement Accuracy Supports High-Precision Measurement of Highly Integrated Stacked Dies

The worldwide embrace of smartphones and tablets with thin form factors is driving demand for semiconductor devices to be smaller and more highly integrated. Extremely precise mold thickness management is necessary for these cutting-edge semiconductor processes. However, quality managementin the molding process has been challenged by the fact that non-destructive mold thickness measurement tools were not available, meaning that engineers must extract individual device samples during the trim and form process and inspect them by microscope.

Advantest's TS9000 MTA Option solves these issues by utilizing terahertz waves to measure mold thickness non-destructively, rapidly, and with a high degree of precision. The system's high throughput enables users to test large volumes of samples and readily grasp the mold thickness distribution of entire lots. For the first time, users can inspect mold thickness during volume production.