TA pogo pin spring socket, with 1.5 nH impedance, for high-speed devices.
HiFIX (High Fidelity Tester Access Fixture)
Device Interface
The HiFIX lineup delivers clean waveform transmission, precision docking, and multi-DUT parallel test, with high reliability.
Along with technology for pico second clean waveform transmission, HiFIX requirements include precision docking and high reliability. ADVANTEST's versatile HiFIX product lineup offers support for requirements including memory, wafer, and manual test. This variety allows us to provide solutions optimized to specific test frequencies and device packages.
To ensure maximum quality of performance, all functions of the HiFix, including continuity and AC/DC checks, are performed throughout the manufacturing process.
Manual HiFIX
This HiFIX is for manual hand test. It is mainly for use in R&D applications, as in evaluation of devices under development. Its specifications can be tailored to the requirements of the customer. This low-cost, reliable product leverages many years of accumulated knowledge and experience at ADVANTEST.
Wafer HiFIX
Wafer motherboard
for T5383
Wafer motherboard
for T5385
This HiFIX supports wafer probers from a variety of companies. Its specifications can be tailored to customer requirements.
Cable-Connected HiFIX
HiFIX for T5585
Connects the performance board and socket board via coaxial cable, allowing even highspeed devices to be tested with precision. Supported packages include: QFP, CSP (μBGA), and TSOP I/II.
SBC-TYPE HiFIX (Socket Board Change)
SBC-TYPE HiFIX for T5503
(DSA)
SBC-TYPE HiFIX for T5503
(motherboard)
Using a high-performance coaxial connector developed by ADVANTEST, it allows DUTs to be swapped out by replacing only the socket board. This mechanism facilitates test of high-speed devices, and also leads to reduced cost of test. The SBC-TYPE HIFIX boasts improved transmission performance, and it entails lower costs when swapping devices. Supported packages include: QFP, CSP (µBGA), and TSOP II.
eSBC-TYPE HiFIX
eSBC-TYPE HiFIX for T5581
(DSA)
eSBC-TYPE HiFIX for T5581
(motherboard)
Complementing the high-performance SBC HiFIX, this HiFIX brings the SBC method to existing test systems. Using a connector developed by ADVANTEST, it also reduces running costs.
Supported packages include: QFP, CSP (μBGA), and TSOP.
ADVANTEST's IC sockets are designed for use with Advantest-manufactured HiFIX products(*) and deliver fast and flexible support for devices with increased speeds and bit-widths, as well as those with progressively narrower ball/lead pitch.
(*) not available for wafer HiFIX
μBGA/CSP Type (1.5nH)
BGA/CSP Socket (1.5nH) Specification
| Socket type | POGO PIN SOCKET |
|---|---|
| Ball pitch | 0.75/0.8/1.0mm |
| Contact resistance (at Au-Pad) | 200mΩ or less (at 20K cycle) |
| Impedance | 1.5nH |
| Contact force | 25 to 35 gf/pin |
| Contact stroke | 0.3mm |
| Service life (mechanical) | 100,000 or more |
| Operating temperature | -55 to +125°C |
| Device type | CSP/BGA |
| Shape of contactor |  |
CSP Type (2.3nH,3.0nH)
Spring probe socket supporting DRAM/flash memory.
CSP Socket (for DRAM/flash memory) Specification
| Socket type | POGO PIN IC SOCKET | |
|---|---|---|
| Ball pitch | 0.5/0.75/0.8/1.0mm | |
| Contact resistance (at Au-Pad) | 200mΩ or less (at 20K cycle) | |
| Impedance | 3.0nH | 2.3nH |
| Contact force | 20 to 30 gf/pin | |
| Contact stroke | 0.35mm | 0.25mm |
| Service life (mechanical) | 100,000 or more | |
| Operating temperature | -55 to +125°C | |
| Device type | CSP | |
| Shape of contactor |  |
 |
TSOP/QFP Type
A socket with 1.8 nH impedance and Y-shaped contactor.
An optional protective sheet is available for protection of the socket board on the gold pad.
TSOP/QFP Socket (1.8nH) Specification
| Socket type | Y CONTACTOR IC SOCKET | |
|---|---|---|
| Lead pitch | 0.5/0.65/0.8mm | |
| Contact resistance (at Au-Pad) | 30mΩ or less (at 10K cycle) | |
| Impedance | 1.8nH | |
| Contact force | 20 to 40 gf/pin | |
| Contact stroke | 0.2mm | |
| Service life (mechanical) | 10,000 or more | |
| Operating temperature | -20 to +125°C | |
| Device type | TSOP/QFP | |
| Shape of contactor |  |
|
BGA/CSP Type (0.4nH)
Leveraging an accumulated expertise in high-speed signal transmission and contact technology, ADVANTEST has this superior IC socket with low impedance and high-frequency characteristics.
BGA/CSP Socket (0.4nH) Specification
| Socket type | RUBBER TYPE IC SOCKET |
|---|---|
| Ball pitch | 0.5/0.65/0.8/1.0mm |
| Contact resistance (at Au-Pad) | 200mΩ or less (at 20K cycle) |
| Impedance | 0.4nH or less |
| Contact force | 20 to 30 gf/pin |
| Operating temperature | -40 to +125°C |