HA1200

Test Handler

Contribute to productivity improvement for high-end SoC devices by high-heat generation test at die-level

Chiplet technology for high-end SoC devices generates high computing power. On the other hand, stacking dies increases the risk of mixing good dies and bad dies and causes many good dies, substrates, and interposers to be discarded.
The new HA1200 handler can be linked with a tester to utilize our unique active thermal control technology for testing singulated and/or partially assembled dies. This technology enables testing of powerful high-end SoCs with 100% test coverage. This helps reduce yield loss at final test, thus reducing losses of final multi-die assembled products.

Die-Level Test

Advantest’s new die-level handler allows full device testing, which is typically only available at final test, to be performed before assembly. This minimizes the risk of mixing good and bad dies on stacked dies.

ATC (Active Thermal Control)

For high heat generation during die test, the HA1200 is linked with a tester to test singulated and/or partially assembled dies with our unique active thermal control technology, which has a strong record in package test. This technology extends the flexibility of test items and helps reduce yield loss in final testing of chiplet devices.

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