TS9000 Series TDR Option

The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.

TS9001 TDR system  

Can be connected to various kinds of probers!

It can be connected to a radio-frequency probing system that you own or have selected, providing flexible solutions that match your device shape and fault analysis environment.

Example of the system configuration

Example of the system configuration

TS9000 series TDR option

An automatic probing mechanism is included as a standard feature!

A probe station is included as a standard feature, which allows the automatic probing of pad coordinates with a measurement distance of up to 300 mm.

System configuration

System configuration


As semiconductor packages grow smaller and become more highly integrated, there is a growing need to locate faults non-destructively and with a high degree of precision. Therefore, it is necessary to have a system that can easily create the optimal analysis environment according to diverse fault analysis conditions.

The TDR analysis of the TS9000 series TDR option and the TS9001 TDR system conducts rapid, high-precision, and non-destructive analysis of faulty areas of the wires in cutting-edge semiconductor packages, electronic components, and printed boards by performing high-resolution TDR measurement (time domain reflectometry) utilizing our proprietary short pulse signal processing technology.

  • Capable of conducting a fault analysis for 2.5D_IC and 3D_IC
    • Resolution for faulty area detection: < 5μm
    • Maximum measurement distance: 300mm
  • Automated TDR measurement

    By using the auto touch-down function of the auto prober, the system conducts precise and reproducible measurements, contributing to the reduction of human errors.

  • DUT temperature control available (TS9001 + external prober connection)

    (Example)SUMMIT200 by FFI (high/low temperature model: -60 ℃ to 300 ℃)

  • A variety of analysis software available

    Failure Position Viewer, which indicates the faulty areas on the CAD data, is provided. (Optional)

TDR Measurement Utilizing THz Technology

Problem in fault analysis using the oscilloscope TDR ⇒ Large error gap in locating fault points

Step response waveforms are used for the probe signals used for the analysis.
The starting points of the amplitude change of the TDR waveforms obtained from good and faulty products are identified as fault points. However, the starting points are unclear, so there is a large error gap in locating the fault points.

By using impulse waveforms for probe signals, fault points are identified easily at pulse peaks (intuitively).

  • Example of TDR measurement with TS900x
    Observes fault points as peaks
  • Example of oscilloscope TDR measurement
    The starting points of the amplitude change are unclear.

Fault analysis of highly integrated LSI packages

1. Fault analysis of the wiring in packages

  • Determines whether a wiring fault point is in the Si Interposer or the package
  • Identifies whether the fault was caused by a factor in the pre-process or post-process

2. Si Interposer mounting (C4 Bump) fault analysis

  • Identifies and analyzes the conditions for mounting the Si Interposer by using a test vehicle
  • Performs fault point analysis of the daisy chain structure on the test vehicle and gives feedback to the mounting conditions.

3. Laminated memory mounting (TSV, Micro-Bump) fault analysis

  • Identifies faulty layers of a laminated chip

4. Wiring fault analysis of printed boards

  • Identifies fault points of the vias and signal lines in stacked boards

Fault analysis of Small-BGA

  • Performs a TDR analysis by forming open faults in the through hole, wiring, and bonding wire in a board
  • Detects the reflected pulse from a fault point even in packages with a complicated structure
  • Sample schematic
  • TDR results

Main Analysis Cases

  • For fault analyses in TSV and other minute vias or between bumps
  • For temperature dependency analyses of faults in contact points
  • For analyses of high-resistance faults, which appear as minute differences between waveforms
1 Board Microstrip line Open
Transmission line Open
2 QFP Bonding wire Open
3 small-BGA Bonding wire Open
Through hole in a board Open
Wiring in a board Open
4 FCBGA Bump Open
Daisy chain Open
Bump High resistance
Near to bumps (Length: <1mm) Open

Main Functions/Specifications

Item TS9000 TS9001
TDR system performance Resolution for faulty area detection 5μm 5μm *4, 10μm *5
Rise time 12ps
Max. measurement distance *1 300mm 100mm
Measurement time *2 300sec/point 30sec/point
Prober performance Prober Original prober Prober from other companies *6
Min. pad *3 100μm 50μm *6
Probing method Automatic Automatic *6
Stage position reproducibility 10μm 1.5μm *6
Stage movable area 150×150mm 203×203mm *6
Sample temperature Room temperature Select from the following temperature ranges. *6,7
Room temperature, Room temperature to +200℃, or -60 to +200℃
Analysis software PC TDR Analyzer Mounted
Analysis PC Provided as a standard feature (OS: Windows 10 Pro. 64-bit)
General specifications Guaranteed performance range Temperature range: 23±5℃ 
Relative humidity: 80% or less (with no condensation)
Operating environment Temperature range: +10 to +30℃
Relative humidity: 80% or less (with no condensation)
Storage environment Temperature range: -10 to +50℃
Relative humidity: 80% or less (with no condensation)

*1 The maximum measurement distance when the effective dielectric constant of the transmission line to be measured is 3.

*2 Number of integration: 1024, Probe contact time not included

*3 The minimum pad that can be monitored by the camera. The minimum pad that the system can contact depends on the probe used.
The minimum contact pad of ACP110 (RC option) by FormFactor, which we recommend, is 40 μm × 70 μm.

*4 @ Time domain: 0 to 800 ps, accumulated 16384 times

*5 @ Time domain: 800 to 1500 ps, accumulated 16384 times

*6 These are the specifications when Prober SUMMIT200 by FormFactor is used.

*7 It may be restricted by the operating temperature range of the probe used. The operating temperature range of ACP110 by FormFactor, which we recommend, is from -65 to +200 ℃.

*8 Optional. Product code: PYTE01-21MAIS

Analysis function

Analyzes fault point extractions (open, short, and impedance mismatch) from the measurement data easily

  • Displays differences from normal product data
  • Peak search
  • Calculations (e.g., deconvolution, smoothing)
  • Displays a marker and cursor on a waveform

Visual analysis that links the analysis data with CAD data1 *1

  • Predicted fault position displayed on the CAD data
  • Support for multiple branches
  • Indication by layer
External output function Output of the measurement data to a CSV file

*1 A function when CAD Data Link option (PYTE01-21MAIS) is used

The TS9000 series TDR option and TS9001 TDR system are equipped with TDR Analyzer as a standard feature. It also has an integration function and supports step waveform analysis (oscilloscope observation).
In addition, by using the TDR CAD Data Link option, faulty areas on the CAD wiring data can be mapped, which makes it easier to deduce the cause for the faults.

Basic functions and usage examples of TDR Analyzer

Basic functions

  1. Waveform calculation functionScaling & offset, smoothing, four arithmetic operations, differential, integral, and normalization
  2. Marker function
    • Indication of the amplitude, time, and distance of a marker position

      Effective dielectric constant specified:
      Calculate the distance from the time

      Distance specified:
      Calculate the effective dielectric constant from the time

    • Peak detection

      Detection by specifying a peak threshold and detection through the rising/falling edge Marking of multiple reflected points

Usage example 1. Normalization calculation

By aligning the waveform levels and phases of the reference (good product) and sample (faulty product) and obtaining the difference, it is possible to extract only the characteristics of the sample waveform.

The waveform characteristics that are common between good and faulty products are canceled, which emphasizes only the characteristics of the faulty product.

Usage example 2. Peak detection function

Finds peaks that meet the conditions from the waveform and displays markers on the waveform. Detecting the peaks makes it easy to locate faults.
Detection is performed by specifying the polarity and threshold value of the peak to be detected. The detected peaks are indicated with markers. The marker positions are displayed in a list.

Basic functions and usage examples of Failure Position Viewer

  1. Loading CAD fileODB++ (advocated by Mentor Graphics Corp. and supported by many industry-leading CAD/CAM vendors)
  2. Specifying TDR measurement positionsIt is possible to click the PAD position to be measured with a mouse to specify a measurement point.
  3. Visualizing predicted fault positionsSupports wiring across multiple layers and branched wires.

Basic functions

Detects peaks that indicate the characteristics of faulty positions by using the waveform calculation and marker functions of TDR Analyzer.

Usage example 3. Visualizing predicted fault positions

When Failure Position Viewer starts, marker positions are displayed in the Viewer, which allows you to predict faulty positions on the CAD data.